Umatshini wokuMakisha we-UV Laser ophathwayo weGlasi yePlastiki
Ukuchaneka okuphezulu, isantya esiphezulu, ukusebenza okuzinzileyo
Ukufikelela okuhle kunye nokuchaneka okuphezulu
Ilogo, ipateni, umbhalo okroliweyo nge-laser
IJade, iglasi, iiseramikhi, iporcelain, ijade, iplastiki, isilicone, isinyithi kunye nezinye iimveliso ezikroliweyo nge-laser
Ibhentshi encinci
Umatshini wokuMakisha weLaser ye-3W UV
Uzinzo lokusebenza ixesha elide, isicelo semizi-mveliso esingama-24/7
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Uhambo lwe-400mm
| Igama lemveliso | Umatshini wokuMakisha i-UV Laser weGlasi yePlastiki |
| Amandla eLaser | 3W 5W 10W |
| Ubude beLaser | 355nm |
| Uluhlu lweeFrequency | 40KHz-300KHz |
| Umgangatho weBeam (M2) | M2≤1.2 |
| Ububanzi bemitha | 0.8±0.1mm |
| Uzinzo lwaMandla oluPhakathi | I-RMS≤3%@iiyure ezingama-24 |
| Ukusetyenziswa kwamandla okuphakathi | <250W |
| Indawo yokuMakisha ngeLaser | 50*50mm/110*110mm/150*150mm |
| Isantya sokuMakisha seLaser | 2000-15000mm/s |
| Indlela Yokupholisa | Ukupholisa umoya/Ukupholisa amanzi |
| Igalelo lamandla | <1000W |
| Imfuneko yeVoltage | 90V-240V 50/60HZ |
| Unxibelelwano lweNdawo yoNxibelelwano | i-USB |
| Umsebenzi wobomi | iiyure ezili-100000 |
| Isixhobo esikhethiweyo | Izibuko zokukhusela zeLaser, i-T-slot, isixhobo esijikelezayo, iJack |
| Ifomathi yeMifanekiso ixhasiwe | I-AI, i-PLT, i-DXF, i-DWG |
| Isoftware yoLawulo | JCZ Ezcad |
| Ubunzima (KG) | 40KG |
| Uqwalaselo | Ibhentshi ephezulu |
| Ixesha lobomi besixhobo selaser | iiyure ezili-100000 |
| Indlela Yokusebenza | Amaza Aqhubekayo |
Ibhentshi encinci
Umatshini wokuMakisha weLaser ye-3W UV
Uzinzo lokusebenza ixesha elide, isicelo semizi-mveliso esingama-24/7
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Uhambo lwe-400mm
Umatshini wokumakisha i-laser ye-MavenLaser UV usebenzisa i-355nm ultraviolet laser ephuhlisiwe, umatshini usebenzisa iteknoloji yokuphindaphinda i-intracavity frequency order yesithathu xa kuthelekiswa ne-infrared laser, indawo egxile kwi-355 UV incinci kakhulu, isiphumo sokumakisha kukuphazamisa ngokuthe ngqo uthotho lweemolekyuli zezinto nge-laser emfutshane ye-wavelength, kunciphisa kakhulu ukuguqulwa koomatshini kwezinto, ukuguqulwa kobushushu (kukukhanya okubandayo), kuba isetyenziselwa ikakhulu ukuMakisha okucolekileyo kakhulu, ukukrola, okufanelekileyo ngakumbi ekutyeni, ukuMakisha izinto zokupakisha zamayeza, ukubhoboza umngxuma omncinci, ukwahlulwahlulwa kwezixhobo zeglasi ngesantya esiphezulu kunye nokusika imizobo enzima yee-silicon wafers kunye nezinye iimboni zesicelo. Inkampani yethu isebenzisa iteknoloji ephucukileyo yamazwe ngamazwe, i-UV laser ipompelwa yi-high-power multi-mode laser diode ukuvelisa i-laser kwaye emva koko iphindaphinde umqadi we-UV laser, kwaye emva koko ngolawulo lwekhompyutha lwe-high-speed scanning mirror deflection ukutshintsha indlela ye-optical ye-laser beam ukuze kufezekiswe ukumakisha ngokuzenzekelayo.


















