Umatshini wokuMiba weLaser ophathwayo we-UV weglasi yePlastiki
Ukuchaneka okuphezulu, isantya esiphezulu, ukusebenza okuzinzileyo
Ukufikelela okuhle kunye nokuchaneka okuphezulu
Ilogo, ipateni, umbhalo okrolwa ngelaser
Ijeyidi, iglasi, iiseramikhi, porcelain, ijeyidi, iplastiki, abicah, isinyithi kunye nezinye iimveliso umkrolo laser
Compact Bench-top
Umatshini wokuMakisha iLaser ye-3W UV
Uzinzo lwexesha elide lokusebenza, 24/7 isicelo ishishini
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Ukuhamba 400mm
| Igama lemveliso | Umatshini wokuMakisha weLaser we-UV weglasi yePlastiki |
| Amandla eLaser | 3W 5W 10W |
| Laser Wavelength | 355nm |
| Uluhlu lokuphindaphinda | 40KHz-300KHz |
| Umgangatho weBeam(M2) | M2≤1.2 |
| Ububanzi beBeam | 0.8±0.1mm |
| Umyinge wozinzo lwaMandla | RMS≤3%@24hr |
| I-Avareji yoSetyenziso lwaMandla | <250W |
| Indawo yokuMakisha iLaser | 50*50mm/110*110mm/150*150mm |
| Isantya sokuMakisha iLaser | 2000-15000mm/s |
| Imo yokupholisa | Ukupholisa umoya/Ukupholisa amanzi |
| Ungeniso lwamandla | <1000W |
| Imfuneko yombane | 90V-240V 50/60HZ |
| INxibelelwano yoNxibelelwano | i-USB |
| Umsebenzi wobomi | 100000 iiyure |
| Isixhobo esinokuzikhethela | Iiglasi ezikhuselayo zeLaser, T-slot, isixhobo sokujikeleza, uJack |
| IFomathi yoMzobo iyaxhaswa | I-AI,PLT,DXF,DWG |
| Ulawulo lweSoftwe | JCZ Ezcad |
| Ubunzima(KG) | 40KG |
| Uqwalaselo | Ibhentshi-phezulu |
| Ubomi besixhobo se-laser | 100000 iiyure |
| Indlela yokuSebenza | I-Wave eqhubekayo |
Compact Bench-top
Umatshini wokuMakisha iLaser ye-3W UV
Uzinzo lwexesha elide lokusebenza, 24/7 isicelo ishishini
Ukuphakama 668mm
Ububanzi 320mm
Ubude 549mm
Ukuhamba 400mm
Umatshini wokumakisha we-MavenLaser UV laser usebenzisa i-355nm ultraviolet laser ephuhlisiwe, umatshini usebenzisa itekhnoloji yokuphinda kabini ye-intracavity ye-intracavity xa kuthelekiswa ne-infrared laser, i-355 ye-UV ekugxilwe kuyo incinci kakhulu, isiphumo sokumakisha kukuphazamisa ngokuthe ngqo ikhonkco lemolekyuli yezinto ngokusebenzisa. I-laser ye-wavelength emfutshane, inciphisa kakhulu ukuguqulwa komatshini wezinto eziphathekayo, ukuguqulwa kobushushu (kukukhanya okubandayo), kuba isetyenziselwa ukuMakisha kwe-ultra-fine, ukukrola, ngokukodwa kulungele ukutya, ukuphawula izinto zokupakisha amayeza, ukubhoboza i-micro-hole, ephezulu. -Ukwahlulwa kwesantya sezinto zeglasi kunye nokusikwa kwemizobo entsonkothileyo yee-silicone wafers kunye namanye amashishini osetyenziso. Inkampani yethu isebenzisa itekhnoloji ephucukileyo yezizwe ngezizwe, i-laser ye-UV impontshwa ngamandla aphakamileyo e-laser diode ye-laser ukuvelisa i-laser kwaye yandise umqa we-laser we-UV, kwaye emva koko ngolawulo lwekhompyuter lokuphambuka kwesipili sokuskena ngesantya esiphezulu ukutshintsha indlela ye-laser optical beam. ukuphumeza ukumakisha okuzenzekelayo.
