Nangona ii-laser ze-ultrafast bezikho kangangeminyaka emininzi, ukusetyenziswa kwemizi-mveliso kuye kwanda ngokukhawuleza kwiminyaka engamashumi amabini edlulileyo. Ngo-2019, ixabiso lemarike le-ultrafast liye landa kakhulu.izinto zelaserukucubungula bekumalunga ne-US $460 yezigidi, kunye nezinga lokukhula lonyaka elihlanganisiweyo le-13%. Iindawo ezisetyenziswayo apho ii-laser ezikhawulezayo zisetyenziswe ngempumelelo ukucubungula izixhobo zoshishino ziquka ukwenziwa kunye nokulungiswa kwe-photomask kwishishini le-semiconductor kunye nokudibanisa i-silicon, ukusika/ukubhala iglasi kunye nokususwa kwefilimu ye-ITO kwii-elektroniki zabathengi ezifana neefowuni eziphathwayo kunye neethebhulethi, ukuthunga kwepiston kwishishini leemoto, ukuveliswa kwe-coronary stent kunye nokuveliswa kwezixhobo ze-microfluidic kwishishini lezonyango.
01 Ukwenziwa nokulungiswa kweePhotomask kwishishini le-semiconductor
Iilaser ezikhawulezayo zasetyenziswa kwenye yezona zicelo zokuqala zoshishino ekucutshungulweni kwezinto. I-IBM ibike ukusetyenziswa kwe-femtosecond laser ablation kwimveliso ye-photomask ngeminyaka yoo-1990. Xa kuthelekiswa ne-nanosecond laser ablation, enokubangela ukutshiza kwesinyithi kunye nomonakalo weglasi, ii-femtosecond laser masks azibonisi ukutshiza kwesinyithi, akukho monakalo weglasi, njl. Iingenelo. Le ndlela isetyenziselwa ukuvelisa iisekethe ezidibeneyo (ii-IC). Ukuvelisa i-IC chip kunokufuna ukuya kuthi ga kwi-30 iimaski kwaye kubiza ngaphezulu kwe-$100,000. Ukucubungula i-Femtosecond laser kunokucubungula imigca kunye namanqaku angaphantsi kwe-150nm.
Umfanekiso 1. Ukwenziwa nokulungiswa kwe-photomask
Umfanekiso 2. Iziphumo zokwenziwa ngcono kweepateni ezahlukeneyo zemaski kwi-ultraviolet lithography egqithisileyo
02 Ukusikwa kweSilicon kwishishini le-semiconductor
Ukusikwa kwe-silicon wafer yinkqubo eqhelekileyo yokuvelisa kwishishini le-semiconductor kwaye kudla ngokwenziwa ngokusebenzisa ukusikwa kwe-mechanical. La mavili okusika adla ngokukhula ii-microcracks kwaye kunzima ukuzisika zibe zincinci (umz. ubukhulu < 150 μm). Ukusikwa kwe-silicon wafers nge-laser kuye kwasetyenziswa kwishishini le-semiconductor kangangeminyaka emininzi, ingakumbi kwii-wafers ezincinci (100-200μm), kwaye kwenziwa ngamanyathelo ahlukeneyo: ukugrumba nge-laser, kulandele ukuhlukaniswa kwe-mechanical okanye ukusika okufihlakeleyo (umz. i-infrared laser beam ngaphakathi kwi-silicon scribing) kulandele ukuhlukaniswa kwe-mechanical tape. I-nanosecond pulse laser inokucubungula ii-wafers ezili-15 ngeyure, kwaye i-picosecond laser inokucubungula ii-wafers ezingama-23 ngeyure, ngomgangatho ophezulu.
03 Ukusika/ukubhala iglasi kushishino lwezinto ze-elektroniki ezisetyenziswayo
Izikrini zokuchukumisa kunye neeglasi zokukhusela zeefowuni eziphathwayo kunye neelaptops ziya zincipha kwaye ezinye iimilo zejometri ziyagoba. Oku kwenza ukusika oomatshini bendabuko kube nzima ngakumbi. Iilaser eziqhelekileyo zihlala zivelisa umgangatho ophantsi wokusika, ngakumbi xa ezi ziboniso zeglasi zibekwe kwiileya ezi-3-4 kwaye iglasi yokukhusela ephezulu eyi-700 μm ithambile, enokwaphuka ngenxa yoxinzelelo lwendawo. Iilaser ezikhawulezayo zibonakalisiwe ukuba ziyakwazi ukusika ezi glasi ngamandla angcono omphetho. Kwisike esikhulu sephaneli esithe tyaba, ilaser ye-femtosecond ingajoliswa kumphezulu ongasemva wephepha leglasi, ikrwele ngaphakathi kweglasi ngaphandle kokonakalisa umphezulu ongaphambili. Iglasi ingaphulwa kusetyenziswa iindlela zoomatshini okanye zobushushu ngokwepateni echongiweyo.
Umfanekiso 3. Ukusika okunemilo ekhethekileyo yeglasi yelaser yePicosecond ultrafast
04 Iintlobo zePiston kwishishini leemoto
Iinjini zeemoto ezikhaphukhaphu zenziwe ngee-alloys ze-aluminium, ezingagugiyo njengentsimbi ephoswe ngesinyithi. Izifundo zifumanise ukuba ukucutshungulwa kweepiston zemoto nge-laser ye-femtosecond kunokunciphisa ukungqubana ukuya kuthi ga kwi-25% kuba ukungcola kunye neoyile kunokugcinwa ngempumelelo.
Umfanekiso 4. Ukulungiswa kweepiston zenjini yemoto nge-laser ye-Femtosecond ukuphucula ukusebenza kwenjini
05 Ukuveliswa kwe-Coronary stent kwishishini lezonyango
Izigidi zee-coronary stents zifakwa kwimithambo yegazi yomzimba ukuze zivule umjelo ukuze igazi lihambe liye kwimithambo yegazi exineneyo, nto leyo esindisa ubomi bezigidi minyaka le. Ii-coronary stents zihlala zenziwe ngentsimbi (umz., intsimbi engatyiwayo, i-nickel-titanium shape memory alloy, okanye i-cobalt-chromium alloy yakutshanje) enobubanzi be-strut obumalunga ne-100 μm. Xa kuthelekiswa nokusika kwe-long-pulse laser, iingenelo zokusebenzisa ii-ultrafast lasers ukusika ii-brackets zikumgangatho ophezulu wokusika, ukugqitywa komphezulu okungcono, kunye nokunciphisa inkunkuma, nto leyo enciphisa iindleko zokulungisa emva kokucubungula.
06 Ukwenziwa kwezixhobo ze-Microfluidic kushishino lwezonyango
Izixhobo zeMicrofluidic zisetyenziswa kakhulu kwishishini lezonyango ukuvavanya nokuchonga izifo. Ezi zihlala zenziwe ngokubumba i-micro-injection kwiindawo ezahlukeneyo uze emva koko ubophe ngokusebenzisa igluing okanye i-welding. Ukwenziwa kwe-ultrafast laser kwezixhobo ze-microfluidic kuneenzuzo zokuvelisa ii-microchannels ze-3D ngaphakathi kwezinto ezibonakalayo ezifana neglasi ngaphandle kwesidingo sokudibanisa. Enye indlela kukwenziwa kwe-ultrafast laser ngaphakathi kweglasi enkulu kulandele ukugrumba ngamakhemikhali amanzi, kwaye enye kukusetyenziswa kwe-femtosecond laser ablation ngaphakathi kweglasi okanye kwiplastiki emanzini acocekileyo ukususa inkunkuma. Enye indlela kukufaka ii-channels kumphezulu weglasi ngomatshini uze uzivale ngesigqubuthelo seglasi nge-femtosecond laser welding.
Umfanekiso 6. Ukukrola okukhethwayo okubangelwa yi-laser ye-Femtosecond ukulungiselela imijelo ye-microfluidic ngaphakathi kwezinto zeglasi
07 Ukubhoboza okuncinci kwe-injector nozzle
Umatshini wokwenza i-microhole yelaser yeFemtosecond uthathe indawo ye-micro-EDM kwiinkampani ezininzi kwimarike ye-injector enoxinzelelo oluphezulu ngenxa yokuguquguquka okukhulu ekutshintsheni iiprofayili zemingxunya yokuhamba kunye namaxesha amafutshane oomatshini. Amandla okulawula ngokuzenzekelayo indawo yokugxila kunye nokuthambekela komqadi ngentloko yokuskena eqhubekekayo kukhokelele kuyilo lweeprofayili zokuvula (umz., i-barrel, i-flare, i-convergence, i-divergence) ezinokukhuthaza i-atomization okanye ukungena kwigumbi lokutsha. Ixesha lokubhola lixhomekeke kumthamo wokukhupha, kunye nobukhulu be-drill obuyi-0.2 - 0.5 mm kunye nobubanzi be-hole obuyi-0.12 - 0.25 mm, okwenza le ndlela ikhawuleze ngokuphindwe kalishumi kune-micro-EDM. Ukuqhuba i-microdrilling kwenziwa ngamanqanaba amathathu, kubandakanya ukurhawuzelela kunye nokugqitywa kwemingxuma ye-through-pilot. I-Argon isetyenziswa njengegesi encedisayo ukukhusela umngxuma kwi-oxidation kunye nokukhusela i-plasma yokugqibela ngexesha lamanqanaba okuqala.
Umfanekiso 7. Ukucubungula ngokuchanekileyo okuphezulu kwe-laser ye-Femtosecond yomngxuma we-taper oguqulweyo we-injector yenjini yedizili
08 Ukulukwa kwe-laser ekhawulezayo kakhulu
Kwiminyaka yakutshanje, ukuze kuphuculwe ukuchaneka koomatshini, kuncitshiswe umonakalo wezinto, kwaye konyuswe ukusebenza kakuhle kokucubungula, intsimi ye-micromachining iye yaba yinto ephambili kubaphandi. I-Ultrafast laser ineenzuzo ezahlukeneyo zokucubungula ezifana nomonakalo ophantsi kunye nokuchaneka okuphezulu, okuye kwaba yinto ephambili ekukhuthazeni uphuhliso lwetekhnoloji yokucubungula. Kwangaxeshanye, ii-ultrafast lasers zinokusebenza kwizinto ezahlukeneyo, kwaye umonakalo wezinto zokucubungula nge-laser ukwayindlela ephambili yophando. I-Ultrafast laser isetyenziselwa ukucima izinto. Xa ubunzima bamandla be-laser buphezulu kunomda wokucima kwezinto, umphezulu wezinto ezivaliweyo uya kubonisa isakhiwo se-micro-nano esineempawu ezithile. Uphando lubonisa ukuba olu Sakhiwo lomphezulu olukhethekileyo yinto eqhelekileyo eyenzekayo xa kulungiswa izinto nge-laser. Ukulungiswa kwezakhiwo ze-micro-nano kumphezulu kunokuphucula iimpawu zezinto ngokwazo kwaye kuvumele uphuhliso lwezinto ezintsha. Oku kwenza ukulungiswa kwezakhiwo ze-micro-nano kumphezulu nge-ultrafast laser ibe yindlela yobugcisa enokubaluleka kophuhliso. Okwangoku, kwizinto zesinyithi, uphando malunga nokuthungwa komphezulu we-laser okhawulezayo lunokuphucula iimpawu zokumanzisa umphezulu wesinyithi, luphucule ukungqubana komphezulu kunye neempawu zokuguguleka, luphucule ukunamathela kwengubo, kunye nokwanda kunye nokunamathela kweeseli kwicala.
Umfanekiso 8. Iipropati ze-superhydrophobic zomphezulu we-silicon olungiselelwe nge-laser
Njengeteknoloji yokucubungula esemgangathweni ophezulu, ukucubungula i-laser ekhawulezayo kuneempawu zommandla omncinci ochaphazeleka bubushushu, inkqubo engangqalanga yokusebenzisana nezinto, kunye nokucubungula okunesisombululo esiphezulu ngaphaya komda wokusasazwa. Inokwenza ukucubungula i-micro-nano esemgangathweni ophezulu kunye nokuchaneka okuphezulu kwezinto ezahlukeneyo. kunye nokuveliswa kwesakhiwo se-micro-nano esinemilinganiselo emithathu. Ukufezekisa ukuveliswa kwe-laser kwezinto ezikhethekileyo, izakhiwo ezintsonkothileyo kunye nezixhobo ezikhethekileyo kuvula iindlela ezintsha zokwenziwa kwe-micro-nano. Okwangoku, i-laser ye-femtosecond isetyenziswa kakhulu kwiindawo ezininzi zesayensi ezisemgangathweni ophezulu: i-laser ye-femtosecond ingasetyenziselwa ukulungiselela izixhobo ezahlukeneyo ze-optical, ezifana nee-microlens arrays, i-bionic compound eyes, ii-optical waveguides kunye ne-metasurfaces; isebenzisa ukuchaneka kwayo okuphezulu, isisombululo esiphezulu kunye ne-Ngezakhono zokucubungula ezinemilinganiselo emithathu, i-laser ye-femtosecond inokulungiselela okanye idibanise ii-chips ze-microfluidic kunye ne-optofluidic ezifana nezixhobo ze-microheater kunye neendlela ze-microfluidic ezinemilinganiselo emithathu; Ukongeza, i-femtosecond laser inokulungiselela iintlobo ezahlukeneyo ze-surface micro-nanostructures ukuze ifezekise imisebenzi yokulwa nokukhanya, ukulwa nokukhanya, i-super-hydrophobic, i-anti-icing kunye neminye; kungekuphela nje koko, i-femtosecond laser ikwasetyenziswe kwicandelo le-biomedicine, ibonisa ukusebenza okugqwesileyo kwiindawo ezifana ne-biological micro-stents, ii-substrates zenkcubeko yeseli kunye ne-biological microscopic imaging. Amathuba esicelo esibanzi. Okwangoku, iindawo zokusetyenziswa kwe-femtosecond laser processing ziyanda unyaka nonyaka. Ukongeza kwi-micro-optics ekhankanyiweyo apha ngasentla, i-microfluidics, i-multi-functional micro-nanostructures kunye nezicelo zobunjineli be-biomedical, ikwadlala indima enkulu kwezinye iindawo ezintsha, ezifana nokulungiselela i-metasurface. , ukuvelisa i-micro-nano kunye nokugcinwa kolwazi lwe-optical olunemilinganiselo emininzi, njl.
Ixesha leposi: Epreli-17-2024
