Umgaqo, iintlobo kunye nokusetyenziswaukucoca nge-laserubuchwepheshe
Iteknoloji yokucoca ilaser yindlela ephumelelayo yokusebenzisa iteknoloji yelaser kwicandelo lobunjineli. Umgaqo wayo osisiseko kukusebenzisa amandla aphezulu elaser ukuze isebenzisane nezinto ezingcolisayo ezinamathele kwisiseko somsebenzi, nto leyo ebangela ukuba zahluke kwisiseko ngendlela yokwanda kobushushu ngoko nangoko, ukunyibilika, kunye nokuphuma kwegesi. Iteknoloji yokucoca ilaser ibonakaliswa ngokusebenza kakuhle, ukuba nobuhlobo nokusingqongileyo, kunye nokugcinwa kwamandla. Isetyenziswe ngempumelelo kwiindawo ezifana nokucoca isikhunta samatayara, ukususa ipeyinti yomzimba wenqwelomoya, kunye nokubuyiselwa kwezinto ezisetyenzisiweyo zenkcubeko.
Ubuchwepheshe bemveli bokucoca buqukaukucoca ukungqubana koomatshini(ukucoca isanti, ukucoca amanzi ngejethi enoxinzelelo oluphezulu, njl. njl.), ukucoca i-corrosion ngeekhemikhali, ukucoca nge-ultrasonic, ukucoca umkhenkce owomileyo, njl. Ezi teknoloji zokucoca zisetyenziswe kakhulu kumashishini ahlukeneyo. Umzekelo, ukucoca isanti kunokususa amabala okugqwala kwesinyithi, ii-metal surface burrs, kunye ne-varnish ene-proof ezintathu kwiibhodi zesekethe ngokukhetha izinto ezirhabaxa zobunzima obahlukeneyo. Iteknoloji yokucoca i-corrosion ngeekhemikhali isetyenziswa kakhulu ekucoceni amabala eoyile kumphezulu wezixhobo, isikali kwiibhoyila, kunye nemibhobho yeoyile. Nangona ezi teknoloji zokucoca ziphuhlisiwe kakuhle, ziseneengxaki ezithile. Umzekelo, ukucoca isanti kunokubangela umonakalo kumphezulu ocociweyo, kwaye ukucoca i-corrosion ngeekhemikhali kunokubangela ungcoliseko lwendalo kunye nokugqwala komphezulu ocociweyo ukuba awuphathwanga ngokufanelekileyo. Ukuvela kwetekhnoloji yokucoca nge-laser kubonisa utshintsho kwitekhnoloji yokucoca. Isebenzisa amandla aphezulu, ukuchaneka okuphezulu, kunye nokudluliselwa ngokufanelekileyo kwamandla e-laser, kwaye ineengenelo ezicacileyo kunetekhnoloji yokucoca yendabuko ngokubhekiselele ekusebenzeni kakuhle kokucoca, ukuchaneka kokucoca, kunye nendawo yokucoca. Ingakuphepha ngempumelelo ungcoliseko lwendalo olubangelwa kukucoca i-corrosion ngeekhemikhali kunye nezinye iiteknoloji zokucoca, kwaye ayizukubangela umonakalo kwi-substrate.
Ngoko ke yintoni ukucocwa nge-laser? Ukucocwa nge-laser yinkqubo apho umqadi we-laser usetyenziselwa ukususa izinto kumphezulu wento eqinileyo (okanye ngamanye amaxesha ulwelo). Xa i-laser flux ephantsi, izinto zifudunyezwa ngamandla e-laser afunxwayo kwaye ziphele okanye zinciphe. Xa i-laser flux ephezulu, izinto zihlala ziguquka zibe yi-plasma. Ngokwesiqhelo, ukucocwa nge-laser kubhekisa ekususeni izinto kusetyenziswa ii-pulsed lasers, kodwa ukuba amandla e-laser aphezulu ngokwaneleyo, umqadi we-laser oqhubekayo ungasetyenziselwa ukususa izinto. I-excimer laser yokukhanya okunzulu kwe-ultraviolet isetyenziselwa ikakhulu i-optical ablation. Ubude be-laser obusetyenziselwa i-optical ablation bumalunga ne-200nm. Ubunzulu bokufunxwa kwamandla e-laser kunye nobungakanani bezinto ezisuswe yi-single laser pulse buxhomekeke kwiimpawu ze-optical zezinto, kunye nobude be-laser kunye nobude be-pulse. Ubunzima obupheleleyo obususwe kwithagethi yi-laser pulse nganye budla ngokubizwa ngokuba yi-ablation rate. Isantya sokuskena se-laser beam kunye nokugubungela umgca wokuskena, njl.njl., kuya kuyichaphazela kakhulu inkqubo ye-ablation.
Iintlobo zeTekhnoloji yokucoca ngeLaser
1) Ukucocwa nge-laser dry: Ukucocwa nge-laser dry kubhekisa ekukhanyeni ngokuthe ngqo kwesixhobo sokucoca nge-pulsed laser, okubangela ukuba isiseko okanye izinto ezingcolisayo kumphezulu zifunxe amandla kwaye zinyuke kubushushu, nto leyo ebangela ukwanda kobushushu okanye ukungcangcazela kobushushu kwesiseko, ngaloo ndlela zahlula zombini. Le ndlela inokwahlulwahlulwa kabini: enye kukuba izinto ezingcolisayo kumphezulu zifunxa amandla e-laser kwaye zande; enye kukuba isiseko sifunxa amandla e-laser kwaye sivelise ukungcangcazela kobushushu. Ngo-1969, u-SM Bedair nabanye bafumanise ukuba iindlela ezahlukeneyo zonyango lomphezulu ezifana nonyango lobushushu, ukubola kweekhemikhali, kunye nokucoca ngesanti zonke zineengxaki ezahlukeneyo. Kwangaxeshanye, uxinano olukhulu lwamandla emva kokujolisa nge-laser lunokwenza ukuba kwenzeke ukufuma komphezulu wezinto, nto leyo evumela ukuba kubekho ukucocwa komphezulu wezinto ezingcolisayo. Ngovavanyo, kwafunyaniswa ukuba ukusebenzisa i-ruby Q-switched laser enoxinano lwamandla angama-30 MW/cm2 kunokufezekisa ukucocwa kwezinto ezingcolisayo kumphezulu wezinto ze-silicon ngaphandle kokonakalisa isiseko, kwaye okokuqala, ukucocwa kwezinto ezingcolisayo kumphezulu wezinto ezingcolisayo nge-laser kwenziwa. Isantya sisonke singabonakaliswa ngesantya sokuqhekeka kweziqwenga zefilimu, ngolu hlobo lulandelayo:
Kwifomyula, i-ε imele isalathisi samandla e-laser pulse, i-h imele isalathisi sobukhulu somaleko wefilimu engcolileyo, kwaye i-E imele isalathisi se-elastic modulus somaleko wefilimu.
2) Ukucocwa ngoManzi ngeLaser: Ngaphambi kokuba umsebenzi oza kucocwa utyhileke kwi-laser eshukumayo, kufakwa ifilimu yolwelo olungaphambi kokugquma umphezulu. Phantsi kwesenzo selaser, ubushushu befilimu yolwelo bunyuka ngokukhawuleza kwaye bube ngumphunga. Ngexesha lokufuma, kwenziwa igagasi lempembelelo, elisebenza kumasuntswana angcolisayo kwaye libangele ukuba ahlukane ne-substrate. Le ndlela ifuna ukuba i-substrate kunye nefilimu yolwelo zingasabelani, ngaloo ndlela kuncitshiswa uluhlu lwezinto ezifanelekileyo. Ngo-1991, uK. Imen nabanye bajongana nengxaki yokungcola okushiyekileyo kwe-sub-micron particle kumphezulu wee-wafers ze-semiconductor kunye nezinto zesinyithi emva kokuba kusetyenziswe iindlela zokucoca zemveli, kwaye bafunda ukusetyenziswa kokugquma ifilimu kumphezulu we-substrate yezinto ezinokufunxa amandla e-laser ngokufanelekileyo. Emva koko, kusetyenziswa i-laser ye-CO2, ifilimu yafunxa amandla e-laser kwaye yanda ngokukhawuleza kubushushu yaza yabila, yavelisa ukufuma okuqhumayo, okwasusa ukungcola kumphezulu we-substrate. Le ndlela yokucoca ibizwa ngokuba yi-laser wet cleaning.
3) Ukucocwa kweLaser Plasma Shock Wave: Amaza okwethuka kweLaser plasma enziwa xa ilaser ikhanyisa umoya kwaye ibangele ukuba kwenziwe i-spherical plasma shock wave. I-shock wave isebenza kumphezulu wesixhobo sokusebenza ukuze icocwe kwaye ikhuphe amandla okususa ungcoliseko. Ilaser ayisebenzi kwi-substrate, ngaloo ndlela ingabangela umonakalo kwi-substrate. Itekhnoloji yokucoca i-laser plasma shock wave ngoku inokucoca amasuntswana aneedayamitha ezingamashumi aliqela ee-nanometers, kwaye akukho mingcele kwi-laser wavelength. Umgaqo wendalo wokucoca i-plasma ungashwankathelwa ngolu hlobo lulandelayo: a) Umqadi welaser okhutshwa yilaser ufunxwa ngumaleko wongcoliseko kumphezulu ocociweyo. b) Inani elikhulu lokufunxwa lenza i-plasma ekhula ngokukhawuleza (igesi engaguqukiyo ene-ionized) kwaye ivelisa i-impact wave. c) I-impact wave ibangela ukuba ungcoliseko luqhekeke kwaye lususwe. d) Ububanzi be-pulse ye-light pulse kufuneka bube bufutshane ngokwaneleyo ukuze kuthintelwe ukuqokelelana kobushushu okunokonakalisa umphezulu ocociweyo. e) Uvavanyo lubonise ukuba xa kukho ii-oxide kumphezulu wesinyithi, i-plasma iveliswa kumphezulu wesinyithi. I-Plasma iveliswa kuphela xa uxinano lwamandla ludlula umda, nto leyo exhomekeke kumgca wokungcola osusiweyo okanye umaleko we-oxide. Le mpembelelo yomgca ibaluleke kakhulu ekucoceni ngempumelelo ngelixa kuqinisekiswa ukhuseleko lwezinto ezingaphantsi komhlaba. Imbonakalo ye-plasma ikwanomlinganiselo wesibini. Ukuba uxinano lwamandla ludlula lo mgca, izinto ezingaphantsi komhlaba ziya konakaliswa. Ukuze kwenziwe ukucoca ngempumelelo ngelixa kuqinisekiswa ukhuseleko lwezinto ezingaphantsi komhlaba, iiparameter ze-laser kufuneka zilungiswe ngokwemeko ukuqinisekisa ukuba uxinano lwamandla e-pulse yokukhanya luphakathi kwemingcele emibini. Ngo-2001, u-JM Lee nabanye basebenzise uphawu lokuba ii-laser ezinamandla aphezulu zivelisa amaza okutsha xa zigxile, kwaye basebenzise i-laser ye-pulse enoxinano lwamandla lwe-2.0 J/cm2 (ephezulu kakhulu kunomlinganiselo womonakalo wee-silicon wafers) ukuze bakhanyisele ngokuhambelana ne-silicon wafer, becoca ngempumelelo ii-tungsten particles ezifakwe kumphezulu we-silicon wafer. Le ndlela yokucoca ibizwa ngokuba yi-laser plasma shock wave cleaning, kwaye ngokungqongqo, i-laser plasma shock wave luhlobo lokucoca i-laser eyomileyo. Injongo yokuqala yezi teknoloji zintathu zokucoca nge-laser yayikukucoca amasuntswana amancinci kumphezulu wee-wafers ze-semiconductor. Kunokuthiwa iteknoloji yokucoca nge-laser yavela ngokuphuhliswa kweteknoloji ye-semiconductor. Nangona kunjalo, iteknoloji yokucoca nge-laser ibisoloko isetyenziswa kwezinye iindawo, ezinje ngokucoca i-mold yamatayara, ukususa ipeyinti yolusu lweenqwelo-moya, kunye nokubuyiselwa komphezulu wezinto ezisetyenzisiweyo. Ngelixa iphantsi kwemitha ye-laser, igesi engasebenziyo inokuvuthelwa kumphezulu we-substrate. Xa ungcoliseko lususiwe kumphezulu, luya kuvuthelwa ngoko nangoko kumphezulu yigesi ukuze kuthintelwe ungcoliseko kwakhona kunye ne-oxidation yomphezulu.
Iukusetyenziswa kwetekhnoloji yokucoca nge-laser
1) Kwintsimi ye-semiconductor, ukucocwa kwee-wafers ze-semiconductor kunye nee-substrates ze-optical kubandakanya inkqubo efanayo, eyokucubungula izinto eziluhlaza zibe ziimo ezifunekayo ngokusika, ukugaya, njl. Ngexesha lale nkqubo, kungeniswa ii-particle contaminants, ezinzima ukuzisusa kwaye zibangele iingxaki ezinkulu zokungcola eziphindaphindwayo. Ii-contaminants ezikumphezulu wee-wafers ze-semiconductor zinokuchaphazela umgangatho wokuprinta ibhodi yesekethe, ngaloo ndlela zifinyeze ubomi bee-chips ze-semiconductor. Ii-contaminants ezikumphezulu wee-substrates ze-optical zinokuchaphazela umgangatho wezixhobo ze-optical kunye neengubo, kwaye zinokukhokelela ekusasazweni kwamandla okungalinganiyo, zifinyeze ubomi. Ekubeni ukucocwa okomileyo nge-laser kunokubangela umonakalo kumphezulu we-substrate, le ndlela yokucoca ayisetyenziswa kakhulu ekucoceni ii-wafers ze-semiconductor kunye nee-substrates ze-optical. Ukucocwa okumanzi nge-laser kunye nokucocwa kwe-laser plasma shock wave kunezicelo eziphumelelayo ngakumbi kweli candelo. UXu Chuanyi nabanye bafunde ukufakwa kwepeyinti ekhethekileyo ye-magnetic ye-micro-scale kumphezulu wee-substrates ze-optical ezigudileyo kakhulu njengefilimu ye-dielectric, baze basebenzise i-laser e-pulsed yokucoca. Isiphumo sokucoca besilungile, nangona inani lamasuntswana angcolileyo kwindawo nganye yeyunithi landa, ubungakanani kunye nendawo yokugubungela amasuntswana angcolileyo yancitshiswa kakhulu. Le ndlela ingazicoca ngempumelelo amasuntswana angcolileyo amancinci kumphezulu we-ultra-smooth optical substrates. UZhang Ping wafunda impembelelo yomgama wokusebenza kunye namandla e-laser kwisiphumo sokucoca sezinto ezahlukeneyo zokungcola kobukhulu besuntswana kwitekhnoloji yokucoca i-laser plasma. Iziphumo zovavanyo zibonise ukuba kumasuntswana e-polystyrene kwi-substrates zeglasi eziqhubayo, umgama ofanelekileyo wokusebenza wamandla angama-240 mJ yayiyi-1.90 mm. Njengoko amandla e-laser esanda, isiphumo sokucoca saphucuka kakhulu, kwaye izinto ezinkulu zokungcola kwaba lula ukuzicoca.
2) Kwintsimi yezinto zesinyithi, ukucocwa kwemiphezulu yezinto zesinyithi kwahlukile ekucocweni kwee-semiconductor wafers kunye ne-optical substrates. Izinto ezingcolisayo eziza kucocwa ziphantsi kodidi lwe-macroscopic. Izinto ezingcolisayo kumphezulu wezinto zesinyithi ziquka ikakhulu umaleko we-oxide (umaleko womhlwa), umaleko wepeyinti, ukugquma, kunye nezinye izinto eziqhotyoshelweyo, kwaye zinokuhlulwa zibe zizinto ezingcolisayo eziphilayo (ezifana nomaleko wepeyinti, ukugquma) kunye nezinto ezingcolisayo ezingaphiliyo (ezifana nomaleko womhlwa). Ukucocwa kwezinto ezingcolisayo kumphezulu wezinto zesinyithi ikakhulu kukufezekisa iimfuno zokucubungula okanye ukusetyenziswa okulandelayo, njengokususa malunga ne-10 μm yomaleko we-oxide kumphezulu weendawo ze-titanium alloy ngaphambi kokuwelda, ukususa upende wokuqala kumphezulu wesikhumba ngexesha lokulungiswa okukhulu kweenqwelo-moya ukuze kube lula ukutshiza kwakhona, kunye nokucoca rhoqo amasuntswana erabha anamathele kwi-mold yerabha ukuqinisekisa ukucoceka komphezulu kunye nomgangatho kunye nobomi be-mold. Umda womonakalo wezinto zesinyithi uphezulu kunowomda wokucoca i-laser ye-laser ye-surface contaminants. Ngokukhetha i-laser yamandla efanelekileyo, isiphumo esingcono sokucoca sinokufezekiswa. Le teknoloji isetyenzisiwe ngokuvuthwa kwiindawo ezithile. UWang Lihua nabanye bafunde ukusetyenziswa kwetekhnoloji yokucoca nge-laser ekunyangeni izikhumba ze-oxide kumphezulu we-aluminium alloys kunye ne-titanium alloys. Iziphumo zophando zibonise ukuba ukusebenzisa i-laser enobunzima bamandla obuyi-5.1 J/cm2 kunokucoca umaleko we-oxide kumphezulu we-aluminium alloy ye-A5083-111H ngelixa kugcinwa umgangatho olungileyo we-substrate, kwaye ukusebenzisa i-pulsed laser enamandla aphakathi kwe-100 W ngendlela yokuskena kunokucoca ngempumelelo umaleko we-oxide kumphezulu we-titanium alloys kwaye kuphucule ubulukhuni bomphezulu wezinto. Iinkampani zasekhaya ezifana neRuike Laser, iDaqu Laser, kunye neShenzhen Chuangxin ziphuhlise izixhobo zokucoca nge-laser eziye zasetyenziswa kakhulu ekucoceni ii-mold zerabha ezifana namatayara, iileya ze-metal rust, kunye namabala eoyile kumphezulu wezinto.
3) Kwicandelo lezinto ezisetyenzisiweyo zenkcubeko, ukucocwa kwezinto ezisetyenzisiweyo zesinyithi nelitye kunye nomphezulu wephepha kuyimfuneko ukususa izinto ezingcolisayo ezifana nokungcola kunye namabala e-inki avela kwiindawo zazo ngenxa yembali yazo ende. Ezi zinto zingcolisayo kufuneka zisuswe ukuze kubuyiselwe izinto ezisetyenzisiweyo. Kwimisebenzi yephepha efana ne-calligraphy kunye nemifanekiso, xa igcinwe ngendlela engafanelekanga, isikhunta sikhula kwiindawo zazo kwaye senze amabala. Ezi ndawo zichaphazela kakhulu inkangeleko yokuqala yephepha, ngakumbi kwiphepha elinexabiso eliphezulu lenkcubeko okanye lembali, eliya kuchaphazela ukuxabiseka kwalo kunye nokukhuselwa kwalo. UZhao Ying nabanye bafunde ukuba kunokwenzeka ukusebenzisa i-ultraviolet laser ukucoca amabala esikhunta kwimiqulu yamaphepha. Iziphumo zovavanyo zibonise ukuba ukusebenzisa i-laser enobunzima bamandla obuyi-3.2 J/mm2 ukuskena kube kanye kunokususa amabala amancinci, kwaye ukuskena kabini kunokususa amabala ngokupheleleyo. Nangona kunjalo, ukuba amandla e-laser asetyenzisiweyo aphezulu kakhulu, aya konakalisa i-scroll yephepha ngelixa esusa amabala. UZhang Xiaotong nabanye babuyisele ngempumelelo i-relic ye-bronze ebhalwe ngegolide besebenzisa indlela ye-laser vertical irradiation liquid film. UZhang Licheng nabanye. basebenzise ubuchwepheshe bokucoca nge-laser ekubuyiseleni umfanekiso wobumba wabasetyhini opeyintwe yiHan Dynasty. UYuan Xiaodong nabanye bafunde impembelelo yeteknoloji yokucoca nge-laser ekucoceni iintsalela zamatye baza bathelekisa umonakalo emzimbeni welitye lesanti ngaphambi nasemva kokucoca, kunye nemiphumo yokucoca amabala e-inki, ungcoliseko lomsi, kunye nongcoliseko lwepeyinti.
Isiphelo: Iteknoloji yokucoca ilaser yindlela ephucukileyo, enophando olubanzi kunye namathuba okusetyenziswa kwiindawo ezichanekileyo ezifana neenqwelo moya, izixhobo zomkhosi, kunye nobunjineli be-elektroniki kunye nombane. Okwangoku, iteknoloji yokucoca ilaser isetyenziswe ngempumelelo kwezinye iindawo, ngenxa yokusebenza kwayo okusebenzayo, okunobuhlobo nokusingqongileyo, kunye nokusebenza kakuhle kokucoca. Iindawo zayo zokusetyenziswa ziyanda kancinci kancinci. Uphuhliso lweteknoloji yokucoca ilaser aluzange lusetyenziswe kuphela kwiindawo ezifana nokususwa kwepeyinti kunye nokususwa komhlwa, kodwa kuye kwakho neengxelo zokusebenzisa ilaser ukucoca umaleko we-oxide kwiintambo zesinyithi kwiminyaka yakutshanje. Ukwandiswa kwamasimi akhoyo okusetyenziswa kunye nophuhliso lwamasimi amatsha sisiseko sophuhliso lwetekhnoloji yokucoca ilaser. Uphando kunye nophuhliso lwezixhobo ezintsha zokucoca ilaser kunye nophuhliso lwezixhobo ezintsha zokucoca ilaser kuya kubonisa umahluko, okubangela imisebenzi eyahlukeneyo. Kwixesha elizayo, ukufezekisa ukucoca ilaser ngokuzenzekelayo ngokupheleleyo ngokusebenzisana neerobhothi zoshishino nako kuya kufezekiswa. Indlela yophuhliso lwetekhnoloji yokucoca ilaser yile ilandelayo:
(1) Ukuqinisa uphando malunga nethiyori yokucoca nge-laser ukuze kukhokele ukusetyenziswa kwetekhnoloji yokucoca nge-laser. Emva kokuphonononga amaxwebhu amaninzi, kufunyaniswe ukuba akukho nkqubo yethiyori evuthiweyo exhasa itekhnoloji yokucoca nge-laser, kwaye uninzi lwezifundo lusekelwe kuvavanyo. Ukuseka inkqubo yethiyori yokucoca nge-laser sisiseko sophuhliso oluqhubekayo kunye nokuvuthwa kwetekhnoloji yokucoca nge-laser.
(2) Ukwandiswa kwamasimi akhoyo okusetyenziswa kunye namasimi amatsha okusetyenziswa. Itekhnoloji yokucoca nge-laser isetyenziswe ngempumelelo kwiindawo ezifana nokususwa kwepeyinti kunye nokususwa komhlwa, kwaye kubekho iingxelo zokusetyenziswa kwe-laser ukucoca umaleko we-oxide kwiintambo zesinyithi kwiminyaka yakutshanje. Ukwandiswa kwamasimi akhoyo okusetyenziswa kunye nophuhliso lwamasimi amatsha ngumhlaba ochumileyo wophuhliso lwetekhnoloji yokucoca nge-laser.
(3) Uphando nophuhliso lwezixhobo ezintsha zokucoca nge-laser. Uphuhliso lwezixhobo ezintsha zokucoca nge-laser luya kubonisa umahluko. Uhlobo olunye zizixhobo ezinazo zonke izinto ezahlukeneyo ezigubungela amasimi amaninzi okusetyenziswa, njengoko isixhobo esinye sinokufezekisa imisebenzi yokususa ipeyinti kunye nokususa umhlwa ngaxeshanye. Olunye uhlobo zizixhobo ezikhethekileyo zeemfuno ezithile, ezinje ngokuyila izixhobo ezithile okanye iifayibha ze-optical ukufezekisa umsebenzi wokucoca ungcoliseko kwiindawo ezincinci. Ngokusebenzisana neerobhothi zoshishino, ukucoca nge-laser ngokuzenzekelayo ngokupheleleyo kukwayindlela ethandwayo yokusetyenziswa.
Ixesha leposi: Julayi-17-2025
