Ukuwelda yinkqubo yokudibanisa iintsimbi ezimbini okanye ngaphezulu ngokusebenzisa ubushushu. Ukuwelda kudla ngokubandakanya ukufudumeza izinto ukuya kwinqanaba lokunyibilika kwazo ukuze isinyithi esisisiseko sinyibilike ukuze kuzaliseke izikhewu phakathi kwamalungu, kwenze unxibelelwano oluqinileyo. Ukuwelda nge-laser yindlela yoqhagamshelwano esebenzisa i-laser njengomthombo wobushushu.
Thatha ibhetri yamandla yesikwere njengomzekelo: isiseko sebhetri siqhagamshelwe yilaser kwiindawo ezininzi. Ngexesha lenkqubo yonke yokuwelda ngelaser, amandla oqhagamshelo lwezinto, ukusebenza kakuhle kwemveliso, kunye nesantya esingalunganga yimiba emithathu exhalabisa kakhulu eli shishini. Amandla oqhagamshelo lwezinto anokubonakaliswa bubunzulu bokungena kwe-metallographic kunye nobubanzi (okunxulumene kakhulu nomthombo wokukhanya kwelaser); ukusebenza kakuhle kwemveliso kunxulumene kakhulu nokukwazi ukucubungula komthombo wokukhanya kwelaser; izinga lesiphene linxulumene kakhulu nokukhetha umthombo wokukhanya kwelaser; ke ngoko, eli nqaku lixoxa ngezinto eziqhelekileyo ezithengiswayo. Kuqhutywa uthelekiso olulula lwemithombo emininzi yokukhanya kwelaser, ngethemba lokunceda abanye abaphuhlisi beenkqubo.
Kubaukuwelda nge-laserNgokusisiseko yinkqubo yokuguqula ukukhanya ukuya kubushushu, iiparameter eziphambili ezininzi ezibandakanyekayo zezi zilandelayo: umgangatho wemitha (BBP, M2, i-divergence angle), uxinano lwamandla, ububanzi obuphambili, uhlobo lokusasazwa kwamandla, intloko yokudibanisa eguquguqukayo, ukucubungula iifestile zenkqubo kunye nezinto ezinokusetyenzwa zisetyenziswa kakhulu ukuhlalutya nokuthelekisa imithombo yokukhanya kwelaser kwezi ndlela.
Uthelekiso lweLaser yeMode enye-ezininzi
Inkcazo yendlela enye yemowudi ezininzi:
Imo enye ibhekisa kwipatheni enye yokusasazwa kwamandla elaser kwiplane enamacala amabini, ngelixa imo eninzi ibhekisa kwipatheni yokusasazwa kwamandla endawo eyenziwe kukubekwa ngaphezulu kweepatheni ezininzi zokusasazwa. Ngokubanzi, ubungakanani bomgangatho we-beam M2 factor bungasetyenziswa ukugweba ukuba imveliso yelaser yefayibha yimo enye okanye imo ezininzi: I-M2 engaphantsi kwe-1.3 yilaser ecocekileyo yemo enye, i-M2 phakathi kwe-1.3 kunye ne-2.0 yilaser yemo enye elinganayo (imo embalwa), kwaye i-M2 inkulu kune-2.0. Kwiilaser zemo ezininzi.
Kubaukuwelda nge-laserNgokusisiseko yinkqubo yokuguqula ukukhanya ukuya kubushushu, iiparameter eziphambili ezininzi ezibandakanyekayo zezi zilandelayo: umgangatho wemitha (BBP, M2, i-divergence angle), uxinano lwamandla, ububanzi obuphambili, uhlobo lokusasazwa kwamandla, intloko yokudibanisa eguquguqukayo, ukucubungula iifestile zenkqubo kunye nezinto ezinokusetyenzwa zisetyenziswa kakhulu ukuhlalutya nokuthelekisa imithombo yokukhanya kwelaser kwezi ndlela.
Uthelekiso lweLaser yeMode enye-ezininzi
Inkcazo yendlela enye yemowudi ezininzi:
Imo enye ibhekisa kwipatheni enye yokusasazwa kwamandla elaser kwiplane enamacala amabini, ngelixa imo eninzi ibhekisa kwipatheni yokusasazwa kwamandla endawo eyenziwe kukubekwa ngaphezulu kweepatheni ezininzi zokusasazwa. Ngokubanzi, ubungakanani bomgangatho we-beam M2 factor bungasetyenziswa ukugweba ukuba imveliso yelaser yefayibha yimo enye okanye imo ezininzi: I-M2 engaphantsi kwe-1.3 yilaser ecocekileyo yemo enye, i-M2 phakathi kwe-1.3 kunye ne-2.0 yilaser yemo enye elinganayo (imo embalwa), kwaye i-M2 inkulu kune-2.0. Kwiilaser zemo ezininzi.
Njengoko kubonisiwe kumfanekiso: Umfanekiso b ubonisa usasazo lwamandla lwendlela enye esisiseko, kwaye usasazo lwamandla kulo naliphi na icala elidlula embindini wesangqa lukwimo yegophe laseGaussian. Umfanekiso a ubonisa usasazo lwamandla eendlela ezininzi, olu lusasazo lwamandla esithuba olwenziwa yi-superposition yeemowudi ezininzi ze-laser enye. Isiphumo se-multi-mode superposition yigophe elithe tyaba.
Iileyiza eziqhelekileyo zemowudi enye: IPG YLR-2000-SM, iSM sisifinyezo seMowudi enye. Ezi zibalo zisebenzisa i-collimated focus 150-250 ukubala ubungakanani bendawo yokugxila, uxinano lwamandla yi-2000W, kwaye uxinano lwamandla okugxila lusetyenziselwa ukuthelekisa.
Uthelekiso lwemowudi enye kunye nemowudi ezininziukuwelda nge-laseriziphumo
I-laser yemowudi enye: ububanzi obuncinci be-core, uxinano lwamandla aphezulu, amandla okungena ngamandla, indawo encinci echaphazeleka bubushushu, efana nemela ebukhali, efanelekileyo ngakumbi ekudibaniseni iipleyiti ezincinci kunye nokunxibelelanisa ngesantya esiphezulu, kwaye ingasetyenziswa ngee-galvanometers ukucubungula iindawo ezincinci kunye neendawo ezikhanyayo kakhulu (iindawo ezikhanyayo kakhulu) iindlebe, iziqwenga zokudibanisa, njl.njl.), njengoko kubonisiwe kumfanekiso ongentla, imowudi enye inomngxuma omncinci kunye nomthamo omncinci womphunga wesinyithi oxinezelekileyo wangaphakathi, ngoko ke ngokubanzi ayinazo iziphene ezifana neembobo zangaphakathi. Ngesantya esiphantsi, imbonakalo irhabaxa ngaphandle kokuvuthela umoya okhuselayo. Ngesantya esiphezulu, ukhuseleko longezwa. Umgangatho wokucubungula igesi ulungile, ukusebenza kakuhle kuphezulu, ii-welds zithambile kwaye zithe tyaba, kwaye izinga lokuvelisa liphezulu. Ifanelekile ekudibaniseni ii-stack kunye nokunxibelelanisa ukungena.
Ilaser yeendlela ezininzi: Ububanzi obukhulu be-core, uxinano lwamandla oluphantsi kancinci kunelaser yendlela enye, imela ecacileyo, umngxuma omkhulu wesitshixo, isakhiwo sesinyithi esityebileyo, umlinganiselo omncinci wobunzulu nobubanzi, kwaye ngamandla afanayo, ubunzulu bokungena buphantsi ngama-30% kunobo belaser yendlela enye, ngoko ke ifanelekile ukusetyenziswa Ifanelekile kwi-butt weld processing kunye ne-thick plate processing enezikhewu ezinkulu ze-assembly.
Umahluko weLaser oneRing edibeneyo
Ukuwelda okuxutyiweyo: Umqadi welaser ye-semiconductor onobude obuyi-915nm kunye nomqadi welaser yefayibha onobude obuyi-1070nm zidityaniswe kwintloko enye yokuwelda. Imiqadi emibini yelaser isasazwa ngokulinganayo kwaye imigca egxile kwimiqadi emibini yelaser inokulungiswa ngokulula, ukuze imveliso ibe nayo yomibini imiqadi ye-semiconductor.ukuwelda nge-laserizakhono emva kokuwelda. Isiphumo siqaqambile kwaye sinobunzulu befayibhaukuwelda nge-laser.
Ii-semiconductors zihlala zisebenzisa indawo enkulu yokukhanya engaphezulu kwe-400um, eyona nto ibangela ukufudumeza kwangaphambili izinto, ukunyibilikisa umphezulu wezinto, kunye nokunyusa izinga lokufunxwa kwezinto ze-fiber laser (izinga lokufunxwa kwezinto ze-laser liyanda njengoko ubushushu busanda)
I-Ring laser: Iimodyuli ezimbini ze-fiber laser zikhupha ukukhanya kwe-laser, okudluliselwa kumphezulu wezinto nge-composite optical fiber (ring optical fiber ngaphakathi kwe-cylindrical optical fiber).
Imisebe emibini yelaser ene-annular spot: iringi engaphandle inoxanduva lokwandisa ukuvulwa kwesitshixo kunye nokunyibilikisa izinto, kwaye iringi engaphakathi inoxanduva lobunzulu bokungena, okuvumela ukuwelda kwe-spatter ephantsi kakhulu. Iidayamitha zamandla e-laser engaphakathi nengaphandle zinokulinganiswa ngokukhululekileyo, kwaye ububanzi be-core bunokulinganiswa ngokukhululekileyo. Ifestile yenkqubo iguquguquka ngakumbi kuneyomqadi welaser omnye.
Ukuthelekiswa kweziphumo zokuwelda ezidityanisiweyo nezijikelezileyo
Ekubeni i-hybrid welding iyindibaniselwano ye-semiconductor thermal conductivity welding kunye ne-fiber optic deep penetration welding, ukungena kweringi yangaphandle akunzulu, isakhiwo se-metallographic sibukhali kwaye sincinci; kwangaxeshanye, inkangeleko ye-thermal conductivity, ichibi elinyibilikisiweyo linokuguquguquka okuncinci, uluhlu olukhulu, kwaye ichibi elinyibilikisiweyo lizinzile ngakumbi, libonakalisa inkangeleko ethambileyo.
Ekubeni i-ring laser iyindibaniselwano ye-deep penetration welding kunye ne-deep penetration welding, i-outer ring inokuvelisa ubunzulu bokungena, obunokwandisa ngempumelelo ukuvulwa kwe-keyhole. Amandla afanayo anobunzulu bokungena obukhulu kunye ne-metallography etyebileyo, kodwa kwangaxeshanye, uzinzo lwedama elinyibilikisiweyo lungaphantsi kancinci. Ukuguquguquka kwe-optical fiber semiconductor kukhulu kancinci kunokwe-composite welding, kwaye uburhabaxa bukhulu kakhulu.
Ixesha lokuthumela: Okthobha-20-2023
