Itekhnoloji yokucoca nge-laseryindlela ephumelelayo yokusebenzisa itekhnoloji yelaser kwicandelo lobunjineli. Umgaqo wayo osisiseko usebenzisa amandla aphezulu eelaser ukuvumela ukusebenzisana phakathi kwemisebe yelaser kunye nezinto ezingcolisayo ezinamathela kwizixhobo zokusebenza. Izinto ezingcolisayo zahlulwe kwizixhobo ngokusebenzisa ukwandiswa kobushushu okukhawulezileyo, ukunyibilika, ukuguquguquka kwegesi kunye nezinye iindlela. Ngenxa yokusebenza kakuhle, ukuba nobuhlobo nokusingqongileyo kunye nokugcinwa kwamandla, itekhnoloji yokucoca ilaser isetyenziswe ngempumelelo ekucoceni isikhunta samatayara, ukususa ipeyinti yomzimba wenqwelomoya, ukubuyiselwa kwezinto zenkcubeko kunye nezinye iindawo.
Ubuchwepheshe bemveli bokucoca buquka ukucoca ngoomatshini (ukuqhushumba kwesanti, ukucoca ngejethi yamanzi ngoxinzelelo oluphezulu, njl.njl.), ukucoca ngomhlwa ngamakhemikhali, ukucoca nge-ultrasonic, ukucoca umkhenkce owomileyo nokunye. Ezi teknoloji zisetyenziswa kakhulu kumashishini onke. Umzekelo, ukuqhushumba ngesanti kunokususa amabala okugqwala kwesinyithi, ii-surface burrs kunye neengubo ezihambelanayo kwiibhodi zesekethe ngokukhetha izinto ezirhabaxa ezinobunzima obahlukeneyo. Ukucoca ngomhlwa ngamakhemikhali kusetyenziswa kakhulu ekususeni isikali seoli yezixhobo, ukucoca isikali sebhoyila kunye nokuvula imibhobho yeoyile. Nangona sele ivuthiwe, iindlela zemveli zineengxaki eziphawulekayo: ukuqhushumba ngesanti konakalisa ngokulula iindawo ezicociweyo, kwaye ukucoca ngomhlwa ngamakhemikhali kubangela ungcoliseko lokusingqongileyo kwaye kunokonakalisa ii-substrates ukuba zisetyenziswa ngendlela engafanelekanga. Ukuvela kokucoca nge-laser kuphawula utshintsho kubuchwepheshe bokucoca. Ukusebenzisa amandla aphezulu e-laser, ukuchaneka kunye nokudluliselwa okusebenzayo, ukucoca nge-laser kudlula iindlela zemveli ekusebenzeni kakuhle kokucoca, ukuchaneka kunye nokubeka indawo. Kususa ungcoliseko lokusingqongileyo oluvela ekucoceni ngamakhemikhali kwaye akubangeli monakalo kwi-substrates.
Imigaqo yokuCoca ngeLaser
Yintoni kanye kanye ukucocwa nge-laser? Ibhekisa kwinkqubo yokususa izinto kwiindawo eziqinileyo (okanye ngamanye amaxesha ezingamanzi) ngokusebenzisa i-laser beam irradiation. Xa i-laser fluence iphantsi, amandla e-laser afunxwayo afudumeza izinto, nto leyo ebangela ukufuma okanye i-sublimation. Xa i-laser fluence iphezulu, izinto zihlala ziguquka zibe yi-plasma. Ukucocwa nge-laser kudla ngokusebenzisa ii-pulsed lasers ukususa izinto, nangona i-continuous-wave laser beams inokususa izinto ngamandla aneleyo. Ii-deep ultraviolet excimer lasers, ezinamaza obude obumalunga ne-200 nm, zisetyenziselwa ikakhulu i-photoablation.
Ubunzulu beamandla elezaukufunxwa kunye nobungakanani bezinto ezisusiweyo nge-pulse nganye kuxhomekeke kwiimpawu ezibonakalayo zezinto, kunye nobude be-laser kunye nobude be-pulse. Ubunzima obupheleleyo obususwe kwithagethi nge-pulse nganye buchazwa njengesantya se-ablation. Iimpawu zemitha ye-laser ezifana nesantya sokuskena kunye nokugubungela umgca zichaphazela kakhulu inkqubo ye-ablation.
Iintlobo zeTekhnoloji yokucoca ngeLaser
1) Ukucoca ngeLaser
Ukucoca nge-laser dry kubandakanyaukukhanyiswa kwemitha yelaser eshukumayo ngqo kwizinto zokusebenza. Izinto ezingcolisayo okanye izinto ezingaphantsi komhlaba zifunxa amandla elaser, zinyusa ubushushu bazo kwaye zibangele ukwanda kobushushu okanye ukungcangcazela kobushushu be-substrate, okwahlula izinto ezingcolisayo kwizinto ezingaphantsi komhlaba. Kwenzeka kwiimeko ezimbini: nokuba izinto ezingcolisayo ezingaphezulu komhlaba zifunxa amandla elaser kwaye zande, okanye izinto ezingaphantsi komhlaba zifunxa amandla kwaye zingcangcazele ngobushushu.
Ngo-1969, uSM Bedair nabanye bafumanise ukuba unyango oluqhelekileyo lomphezulu (unyango lobushushu, ukubola kwamakhemikhali, ukuqhumisa isanti) zonke ezi zinto zazinemida. Baqaphele ukuba uxinano olukhulu lwamandla eelaser ezigxileyo lunokutshintsha izinto zomphezulu ngaphandle kokonakalisa ii-substrates. Uvavanyo luqinisekisile ukuba ilaser yeruby eguquliweyo ye-Q enoxinano lwamandla lwe-30 MW/cm² inokucoca ukungcola kwiindawo zesilicon ngaphandle komonakalo we-substrate, nto leyo ephawula ukuphunyezwa kokuqala kokucoca nge-laser dry.
Izinga lokucoca lilonke lingabonakaliswa ngezinga lokususwa kweenkunkuma zefilimu, njengoko kubonisiwe ngezantsi:
(Ifomula: ε—isalathisi samandla okubetha kwelaser; h—isalathisi sobukhulu befilimu engcolileyo; isalathisi se-modulus ye-elastic yefilimu ye-E)
2) Ukucoca ngamanzi ngeLaser
Ngaphambi kokuba kusetyenziswe i-laser radiation, ifilimu engamanzi igqunywa kwangaphambili kumphezulu we-workpiece. Amandla e-laser ayayifudumeza ngokukhawuleza aze ayitshise ifilimu, ivelise i-shockwave ekhawulezileyo esusa amasuntswana angcolisayo kwi-substrate. Le ndlela ayifuni mpendulo yeekhemikhali phakathi kwe-substrate kunye nefilimu engamanzi, nto leyo ethintela izinto zayo ezifanelekileyo.
Ngo-1991, uK. Imen nabanye bajongana nezinto ezingcolisayo ezisele kwi-submicron kwii-wafers ze-semiconductor kunye neentsimbi emva kokucoca okuqhelekileyo. Bagquma izinto ezingcolisayo ngefilimu efunxa i-laser baza bazikhanyisa nge-laser ye-CO₂. Ifilimu yafunxa amandla, yafudunyezwa ngokukhawuleza, yabila yaza yatshiswa ngumphunga, isusa izinto ezingcolisayo kumphezulu—oku kuchaza ukucocwa okumanzi nge-laser.
3) Ukucoca i-Laser Plasma Shockwave
Amaza omlilo eplasma yelaser ayenzeka xa iilaser zenza umoya ube yi-plasma shockwaves engqukuva ngexesha lokukhanyiswa. La maza omlilo ahlasela ii-substrates, ekhupha amandla okususa ukungcola ngaphandle kokonakalisa i-substrate (ii-laser azisebenzisani ngokuthe ngqo nee-substrates). Le teknoloji ihlambulula amasuntswana amancinci anjengee-nanometers ezilishumi kwaye ayibeki miqathango kwi-laser wavelength.
Imigaqo ebonakalayo yokucoca i-plasma ishwankathelwe ngolu hlobo lulandelayo:
a) Imisebe yelaser ifunxwa ngumaleko ongcolisayo kumphezulu ekujoliswe kuwo.
b) Ukufunxwa kwamandla aphezulu kwenza i-plasma ekhula ngokukhawuleza (igesi engaguqukiyo ene-ionized highly), ivelisa amaza othusayo.
c) Amaza omlilo ayaqhekeza aze asuse izinto ezingcolisayo.
d) Iipulse zelaser mazibe mfutshane ngokwaneleyo ukuze kuthintelwe ukuqokelelana kobushushu okonakalisa isiseko.
e) Uvavanyo lubonisa iifom zeplasma kwiindawo zesinyithi xa kukho ii-oxides.
Ukuveliswa kweplasma kwenzeka kuphela ngaphezulu komda woxinano lwamandla, oxhomekeke kumgca ongcolileyo okanye i-oxide oza kususwa. Kukho umda wesibini ophezulu, ngaphaya kwawo owonakaliswe yi-substrate. Ukuqinisekisa ukucocwa ngokufanelekileyo ngaphandle komonakalo we-substrate, iiparameter ze-laser kufuneka zilungiswe ukuze kugcinwe umxinano wamandla e-pulse phakathi kwemida emibini.
Ngowama-2001, uJM Lee nabanye basebenzisa amaza okutshisa eplasma avela kwiilaser ezigxile kumandla aphezulu. Ilaser eshukumayo enobunzima bamandla obuyi-2.0 J/cm² (edlula kakhulu umda womonakalo wesilicon) yakhanyisa ii-wafers zesilicon ngaxeshanye, yasusa ngempumelelo iisuntswana ze-tungsten eziyi-1 μm. Enyanisweni, ukucocwa kwe-laser plasma shockwave yinxalenye yokucoca okomileyo.
Ekuqaleni yaphuhliswa ukuze isuse amasuntswana amancinci kwii-semiconductor wafers, ezi teknoloji zintathu zokucoca nge-laser zandisiwe ukuya ekucoceni isikhunta samatayara, ukususa ipeyinti yolusu ngenqwelomoya, ukubuyiselwa kwezinto ezisetyenzisiweyo kunye nokunye. Igesi engasebenziyo ingavuthelwa kwiindawo ezingaphantsi komhlaba ngexesha lokukhanya nge-laser ukuze isuse ngoko nangoko izinto ezingcolisayo ezisusiweyo, ithintele ukuphinda kusetyenziswe i-oxidation.
Ukusetyenziswa kweTekhnoloji yokucoca ngeLaser
1) Ishishini leSemiconductor: Ukucocwa kweeWafers zeSemiconductor kunye neeSubstrates zeOptical
Ii-wafers ze-semiconductor kunye nee-substrates ze-optical zihamba ngamanyathelo afanayo okucubungula (ukusika, ukugaya) ukwenza iimilo ezifunwayo, zingenisa ii-particles ezingcolisayo ezinzima ukuzisusa kwaye zinokususwa lula. Ii-contaminants ezikwii-wafers ziphazamisa umgangatho wokuprinta kwesekethe kwaye zifinyeze ubomi be-chip. Kwii-substrates ze-optical, zonakala ukusebenza kwesixhobo se-optical kunye ne-coating, nto leyo ebangela ukusasazwa kwamandla okungalinganiyo kunye nobomi benkonzo obuncitshisiweyo.
Ukucoca nge-laser dry akuxhaphakanga apha ngenxa yemingcipheko yomonakalo we-substrate, ngelixa ukucoca okumanzi kunye nokucoca nge-plasma shockwave kunezicelo ezininzi eziphumelelayo. UXu Chuanyi nabanye bafake ipeyinti ye-magnetic ye-micron-scale njengefilimu ye-dielectric kwi-ultra-smooth optical substrates, nto leyo eyafezekisa ukucoca nge-pulsed laser ngempumelelo. Nangona amasuntswana angcolileyo anda, ubungakanani bawo kunye nokugubungela kwawo kwehla kakhulu. UZhang Ping wafunda imiphumo yomgama wokusebenza kunye namandla e-laser ekusebenzeni kakuhle kokucoca kwamasuntswana anobukhulu obahlukeneyo. Uvavanyo lubonise ukuba i-240 mJ laser iphumelele ukucoca ngokufanelekileyo amasuntswana e-polystyrene kwiglasi eqhubayo kumgama wokusebenza we-1.90 mm. Ukusebenza kakuhle kokucoca kuphuculwe ngamandla aphezulu e-laser, kwaye amasuntswana amakhulu kulula ukuwasusa.
2) Ishishini lesinyithi: Ukucocwa komphezulu wesinyithi
Ukucocwa komphezulu wesinyithi kujolisa kwizinto ezingcolisayo ezinkulu: iileya ze-oxide/rust, ipeyinti, ii-coating kunye nezinye izinto ezincamathiselweyo, ezihlelwe njengezinto eziphilayo (ipeyinti, ii-coating) okanye ezingcolisayo ezingaphiliyo (umhlwa). Ukucocwa kuyahlangabezana neemfuno zokucubungula/zokusebenzisa ezilandelayo: umz., ukususa iileya ze-oxide ezibukhulu be-10 μm kwii-alloys ze-titanium ngaphambi kokuwelda, ukususa ipeyinti kwizikhumba zeenqwelo-moya ukuze ipeyintwe kwakhona, kunye nokucoca intsalela yerabha kwii-molds zamatayara ukuqinisekisa umgangatho wemveliso kunye nobomi be-mold.
Iintsimbi zinemilinganiselo ephezulu yomonakalo kunemilinganiselo yazo yokucoca engcolileyo, nto leyo evumela ukucoca okusebenzayo ngee-laser ezisebenza ngokufanelekileyo. Ukusetyenziswa okuvuthiweyo kuquka: UWang Lihua et al. babonise ukuba i-laser ye-5.1 J/cm² isuse iileya ze-oxide kwi-aluminium alloy ye-A5083-111H ngelixa igcina umgangatho we-substrate, kwaye i-laser ye-100 W pulsed icoce ngempumelelo iileya ze-titanium alloy oxide kunye nokuqina komphezulu okuphuculweyo. Abavelisi basekhaya (uRaycus Laser, uHan's Laser, uShenzhen Chuangxin) babonelela kakhulu ngezixhobo zokucoca i-laser zeemold zerabha, umhlwa wesinyithi kunye nokususwa kweoyile yenxalenye.
3) Ukugcinwa kweeRelics zeNkcubeko: Ukucocwa kweeRelics zeNkcubeko kunye neeArtifacts zePhepha
Izinto ezisetyenzisiweyo zenkcubeko zesinyithi nelitye ziqokelela ukungcola, amabala einki kunye nezinye izinto ezingcolisayo ngokuhamba kwexesha, nto leyo edinga ukususwa ukuze kubuyiselwe ukubonakala kwasekuqaleni. Izinto ezenziwe ngamaphepha (imizobo, i-calligraphy) zivelisa ukungunda kunye neeplaque ngexesha lokugcinwa ngendlela engafanelekanga, nto leyo eyonakalisa kakhulu imeko yazo kunye nexabiso lenkcubeko/lembali.
UZhao Ying nabanye baqinisekisile ukucocwa kwe-UV nge-laser ye-mold plaques kwiphepha lerayisi: ukuskena kube kanye kwi-3.2 J/mm² kususe iiplaques ezincinci, ngelixa ukuskena kabini kufikelele ekususweni ngokupheleleyo; amandla e-laser amaninzi awonakalise iphepha. UZhang Xiaotong ubuyisele ngempumelelo into eyenziwe ngegolide yebronze esebenzisa indlela ye-laser wet. UZhang Licheng wasebenzisa ukucocwa kwe-laser kwimifanekiso yodongwe yabasetyhini epeyintiweyo evela kwiHan Dynasty. UYuan Xiaodong nabanye bavavanye ukusebenza kakuhle kokucocwa kwe-laser kwiintsalela zamatye, bethelekisa umonakalo we-substrate kunye nokusebenza kakuhle kokususa i-inki, umsi kunye namabala epeyinti kwisanti.
Isiphelo
Ukucocwa nge-laser bubuchwepheshe obuphambili obunophando olubanzi kunye namathuba okusetyenziswa kwi-aerospace, izixhobo zomkhosi, izixhobo ze-elektroniki kunye nezinye iindawo ezichanekileyo. Ivuthwe kumashishini amaninzi ngenxa yokusebenza kwayo kakuhle, ukuba nobuhlobo nokusingqongileyo kunye neziphumo zokucoca ezigqwesileyo, ukusetyenziswa kwayo kuyaqhubeka nokwanda. Ngaphaya kokususwa kwepeyinti kunye nomhlwa okusekwe, inkqubela phambili yakutshanje ibandakanya ukucocwa nge-laser kwee-oxide layers kwiingcingo zesinyithi. Uphuhliso lwexesha elizayo luxhomekeke ekwandiseni izicelo ezikhoyo, ukungena kumacandelo amatsha kunye nokuvelisa izixhobo ezintsha:
- Qinisa uphando lwethiyori ukuze lukhokele ukusetyenziswa okusebenzayo. Uphando lwangoku luxhomekeke kakhulu kwiimvavanyo, lungenaso isakhelo sethiyori esivuthiweyo. Ukuseka isakhelo esinjalo kubalulekile ekuvuthweni kobuchwepheshe.
- Yandisa ukusetyenziswa kwiindawo ezikhoyo nezintsha. Ukususwa kwepeyinti/umhlwa okuvuthwayo, ukusetyenziswa okutsha kuquka ukucoca i-metal wire oxide, okubonelela ngomhlaba ochumileyo wokukhula.
- Ukuphuhlisa izixhobo ezintsha zokucoca nge-laser, ezahlulwe zibe zizixhobo ezisetyenziswa kwiindawo ezahlukeneyo (umz., ukususa ipeyinti/umhlwa ngokudibeneyo) kunye nezixhobo ezikhethekileyo (umz., izixhobo ezenziwe ngokwezifiso/iifayibha zeendawo ezixineneyo). Ukuziqhelanisa ngokupheleleyo ngokudibanisa neerobhothi zoshishino yindlela ethembisayo.
Ixesha leposi: Meyi-14-2026
