Ukucoca nge-laseryiteknoloji yonyango lomphezulu ephucukileyo esebenzisa imisebe yelaser enamandla aphezulu ukuze iphele ngoko nangoko kwaye isuse iziqhoboshelo zomphezulu (izinto ezingcolileyo, umhlwa, iingubo, njl.njl.). Xa kuthelekiswa neendlela zemveli zokucoca ngoomatshini, iikhemikhali kunye ne-ultrasonic, ukucoca ngelaser kuneenzuzo ezibalulekileyo ezifana nokuchaneka, ukusebenza kakuhle kunye nokulawulwa, okunokuphucula ngempumelelo umgangatho womphezulu wezixhobo kwaye kwandise ubomi bazo benkonzo. Ngokuphuculwa okuqhubekayo kweemfuno zomgangatho womphezulu kuphuhliso lwemizi-mveliso, iteknoloji yokucoca yendabuko ngokuthe ngcembe ayikwazi ukuhlangabezana neemfuno. Ukucoca ngelaser, ngeempawu zayo zokungachukumisi, ezingonakalisiyo nezinobuhlobo nokusingqongileyo, kuye kwaba yiteknoloji ephambili yokuphucula ukusebenza kwezixhobo kwimveliso yanamhlanje.
Umzobo wesicwangciso sokucoca nge-laser
Ukusetyenziswa kokucoca nge-laser kwicandelo lemizi-mveliso
Ngokuthandwa kweengcamango zokuvelisa izinto ezikrelekrele kunye nokuvelisa izinto eziluhlaza,iteknoloji yokucoca nge-laseringena kwixesha lophuhliso olukhawulezileyo, kwaye amathuba okusetyenziswa kwayo kwicandelo lemizi-mveliso abanzi. Le teknoloji, kunye neenzuzo zayo zokuba nobuhlobo nokusingqongileyo, ukusebenza kakuhle nokuchaneka, ithatha indawo yeendlela zokucoca zemveli kancinci kancinci kwaye isetyenziswa kakhulu kwiindawo eziphambili ezifana nokuveliswa kwezixhobo eziphezulu, izixhobo ze-elektroniki ezichanekileyo kunye neenqwelo moya. Okwangoku, ukuvela okuqhubekayo kwezixhobo ezintsha kunye neenkqubo ezintsha kuya kwandisa ngakumbi imida yokusetyenziswa kokucoca nge-laser. Ngezantsi, siza kwazisa usetyenziso oluphambili lokucoca nge-laser kushishino ngokusebenzisa izixhobo ezahlukeneyo.
Ukucocwa nge-laser kusetyenziswa kakhulu kwicandelo lezinto zesinyithi ukususa iifilimu zeoyile, iipeyinti, iipeyinti kunye neeleya ze-oxide. Umzekelo, kumphezulu wentsimbi yekhabhoni, intsimbi engatyiwayo kunye ne-aluminium alloy, ii-laser zinokususa ngokufanelekileyo amabala eoyile kunye nee-lubricants ngaphandle kokonakalisa i-substrate. Kwiisikhumba zeenqwelo-moya, iindawo zeemoto, njl.njl., ii-laser zinokususa ngokukhethekileyo iipeyinti ezindala okanye iipeyinti kwaye zibonelele ngokunamathela okungcono kwiipeyinti ezintsha. Ukongeza, ukucocwa nge-laser kunokususa ngokufanelekileyo umaleko we-oxide kumphezulu weentsimbi (ezifana nentsimbi yekhabhoni kunye nee-titanium alloys), kuphucule umgangatho wokuwelda kunye nokupeyinta, kwaye kwezinye iimeko, isiphumo sayo singcono kuneso sokupolisha ngoomatshini bendabuko.
Umzobo wesicwangciso onxulumene nokucocwa kwezinto zesinyithi nge-laser
Phakathi kwezinto ezingezizo ezesinyithi, ukucocwa nge-laser kusebenza kwizinto zokukhusela (iglasi, i-ceramics, irabha ye-silicone), ilitye kunye nezinto ezidityanisiweyo. Umzekelo, ii-laser zinokucoca izinto zokukhusela kwizixhobo zamandla ngaphandle kokonakalisa okanye zisuse i-pigment graffiti kunye ne-biofilms kumphezulu we-granite. Kwiplastiki eqinisiweyo ye-carbon fiber (CFRP), ii-laser zinokususa ngokuchanekileyo umaleko we-epoxy resin, zonyuse amandla okubopha, kwaye zithintele umonakalo we-fiber obangelwa kukugaywa koomatshini. Umfanekiso 3 ubonisa uthelekiso olukhulu lwe-CFRP ngaphambi nasemva kokucocwa nge-laser.
Ukuthelekisa i-CFRP ngaphambi nasemva kokucocwa nge-laser
Ukwenziwa kwee-semiconductors kuneemfuno eziphezulu kakhulu zococeko. Ukucoca nge-laser kunokususa ngokufanelekileyo amasuntswana e-nanoscale (afana ne-alumina kunye namasuntswana e-copper) kumphezulu wee-silicon wafers, ukuqinisekisa ukucutshungulwa ngokuchanekileyo kweesekethe ezidibeneyo. Ukongeza, ii-laser zikwasetyenziselwa ukucoca i-photomask, ukuthintela umonakalo we-substrate ngokusebenzisa indlela ye-plasma shock wave, kwaye zifanelekile kwiiteknoloji eziphambili ezifana ne-ultraviolet lithography egqithisileyo.
Umfanekiso wokuthelekisa wokucoca nge-laser umphezulu we-silicon wafer
Ukucocwa kwelaser, ngobuchule bayo obuphezulu, ububele kwindalo esingqongileyo kunye nokusetyenziswa kwayo ngokubanzi, kubonakalise amandla amakhulu kwiinkalo zesinyithi, ezingezizo zesinyithi, ii-semiconductors kunye namashishini akhethekileyo. Kwixesha elizayo, obu buchwephesha buza kufezekisa inkqubela phambili kwiindlela ezintathu eziphambili: ukwenziwa kwemveliso okuphezulu, ukukhuselwa kwendalo eluhlaza kunye nokusetyenziswa okukrelekrele. Kwicandelo lokuvelisa eliphezulu, ukucocwa kwelaser kuya kusetyenziswa kakhulu kwiikhonkco eziphambili zenkqubo ezifana nokugcinwa kwezinto ezichanekileyo ze-aerospace, unyango lwangaphambi kokuwelda kwebhetri yesithuthi esitsha samandla, kunye nokucocwa kwee-wafers ze-semiconductor, ukukhuthaza ukuphuculwa okubanzi kokuchaneka nokusebenza kakuhle kwemveliso. Ngokuphathelele ukhuseleko lwendalo, uphawu lwayo olungenangcoliseko luya kukhawulezisa ukutshintshwa kweenkqubo zemveli zokucoca iikhemikhali, ngakumbi kwiinkalo ezineemfuno ezingqongqo kwindalo esingqongileyo ezifana nonyango lwenkunkuma yenyukliya kunye nokugcinwa kwezixhobo ze-petrochemical. Ngokuphathelele uphuhliso olukrelekrele, ngokudityaniswa nokuqatshelwa okubonakalayo kwe-AI kunye netekhnoloji yerobhothi yemizi-mveliso, ukucocwa kwelaser kuya kufezekisa ukulungiswa kweparameter eguquguqukayo kunye nokusebenza okuzimeleyo phantsi kweemeko zokusebenza ezinzima, kwandise kakhulu iimeko zokusetyenziswa kwayo.
Ixesha leposi: Julayi-10-2025
