Nangona ii-lasers ze-ultrafast sele zikhona amashumi eminyaka, izicelo zemizi-mveliso zikhule ngokukhawuleza kule minyaka ingamashumi amabini idlulileyo.Ngo-2019, ixabiso lemarike ye-ultrafastizinto laserukusetyenzwa kwakumalunga nama-460 ezigidi zeedola zaseMelika, kunye nezinga lokukhula elihlangeneyo lonyaka le-13%.Iindawo zesicelo apho i-laser ye-ultrafast isetyenziswe ngempumelelo ekuqhubeni imathiriyeli yemizi-mveliso ibandakanya ukwenziwa kwefotomask kunye nokulungiswa kwishishini le-semiconductor kunye ne-silicon dicing, ukusika iglasi / i-scribing kunye (i-indium tin oxide) ukususwa kwefilimu ye-ITO kwizinto zombane zabathengi ezifana neeselfowuni kunye neetafile. , i-piston texturing ye-automotive industry, i-coronary stent production kunye ne-microfluidic device eveliswa kwishishini lezonyango.
01 Ukwenziwa kweFotomask kunye nokulungiswa kwishishini le-semiconductor
I-laser ye-Ultrafast isetyenziswe kwenye yezicelo zokuqala zoshishino kwi-processing materials.I-IBM ibike ukusetyenziswa kwe-femtosecond laser ablation kwimveliso ye-photomask kwi-1990s.Xa kuthelekiswa ne-nanosecond laser ablation, enokuvelisa i-spatter yensimbi kunye nomonakalo weglasi, iimaski ze-laser ze-femtosecond zibonisa ukuba akukho sitshizi sesinyithi, akukho monakalo weglasi, njl.Le ndlela isetyenziselwa ukuvelisa iisekethe ezidibeneyo (ICs).Ukuvelisa itshiphu ye-IC kunokufuna ukuya kutsho kwiimaski ezingama-30 kwaye kuxabisa > $100,000.I-Femtosecond laser processing inokuqhuba imigca kunye namanqaku angaphantsi kwe-150nm.
Umzobo 1. Ukwenziwa kweFotomask kunye nokulungiswa
Umzobo 2. Iziphumo zokuphucula iipatheni zeemaski ezahlukeneyo kwi-ultraviolet lithography egqithisileyo
02 Ukusika i-silicon kwishishini le-semiconductor
I-Silicon wafer dicing yinkqubo yokwenziwa kwesiqhelo kwishishini le-semiconductor kwaye iqhele ukwenziwa kusetyenziswa ukudaywa ngoomatshini.La mavili okusika ahlala ephuhlisa i-microcracks kwaye kunzima ukusika (umzekelo, ubukhulu be-< 150 μm) iiwafers.Ukusika i-laser yee-silicon wafers isetyenziswe kwishishini le-semiconductor iminyaka emininzi, ngakumbi kwii-wafers ezibhityileyo (100-200μm), kwaye zenziwa ngamanyathelo amaninzi: i-laser grooving, ilandelwa kukwahlulwa koomatshini okanye ukusika okufihlakeleyo (okt infrared laser beam ngaphakathi. I-silicon scribing) ilandelwa kukwahlulwa kweteyiphu ngomatshini.I-nanosecond pulse laser inokuqhuba ii-wafers ezili-15 ngeyure, kwaye i-picosecond laser inokuqhuba ii-wafers ezingama-23 ngeyure, ezinomgangatho ophezulu.
03 Ukusika iglasi/ukubhala kwishishini lee-elektroniki ezisetyenziswayo
Izikrini zokuchukumisa kunye neeglasi ezikhuselayo zeefowuni eziphathwayo kunye neelaptops ziya zibhitya kwaye ezinye iimilo zejometri ziyajika.Oku kwenza ukusika oomatshini bemveli kube nzima ngakumbi.Iilaser eziqhelekileyo zivelisa umgangatho ombi wokusikwa, ngakumbi xa ezi ziboniso zeglasi zipakishwe 3-4 umaleko kwaye umphezulu we-700 μm yeglasi ekhuselayo engqingqwa, enokwaphuka ngoxinzelelo lwasekhaya.I-laser ye-Ultrafast ibonakaliswe ukuba iyakwazi ukusika ezi glasi ngamandla angcono asemaphethelweni.Ukusikwa kwepaneli enkulu yeflethi, i-laser ye-femtosecond inokujoliswa kumqolo ongemva wephepha leglasi, ukukrwela ngaphakathi kweglasi ngaphandle kokonakalisa umphezulu ongaphambili.Iglasi ke ngoko inokwaphulwa kusetyenziswa oomatshini okanye iindlela ezishushu ecaleni kwepateni efunyenweyo.
Umzobo 3. Picosecond ultrafast laser glass special-shaped cut
04 Ubume bePiston kushishino lweemoto
Iinjini zeemoto ezikhaphukhaphu zenziwe ngealloyi ze-aluminium, ezingaxhathisiyo njengentsimbi.Uphononongo lufumanise ukuba i-femtosecond laser process ye-car piston textures inokunciphisa ukungqubana ukuya kuthi ga kwi-25% kuba inkunkuma kunye ne-oyile inokugcinwa ngokufanelekileyo.
Umzobo 4. Ukulungiswa kwe-laser ye-Femtosecond yeepiston ze-injini yemoto ukuphucula ukusebenza kwe-injini
05 Ukuveliswa kwestent kwishishini lezonyango
Izigidi zeecoronary stents zimiliselwa kwimithambo yemithambo yentliziyo ukuze kuvuleke umjelo wokuba igazi likwazi ukuya kwimithambo ejiyileyo, nto leyo esindisa izigidi zabantu nyaka ngamnye.Izinti zeCoronary zenziwa ngentsimbi (umzekelo, intsimbi engatyiwa, ingxubevange yenkumbulo yenickel-titanium, okanye ingxubevange yecobalt-chromium esandul' ukutsha nje) intambo yocingo enobubanzi obumalunga ne-100 μm.Xa kuthelekiswa nokusika i-laser ye-pulse-long-pulse, izibonelelo zokusebenzisa i-laser ye-ultrafast ukusika izibiyeli ngumgangatho osikiweyo ophezulu, ukugqiba umgangatho ongcono, kunye ne-debris encinci, enciphisa iindleko ze-post-processing.
06 Ukwenziwa kwezixhobo zeMicrofluidic kushishino lwezonyango
Izixhobo zeMicrofluidic ziqhele ukusetyenziswa kwishishini lezonyango ukuvavanya isifo kunye nokuxilongwa.Ezi ziqhele ukwenziwa ngokubunjwa kwe-micro-injection yamalungu ngamanye kwaye emva koko idibanise usebenzisa igluing okanye i-welding.I-Ultrafast laser fabrication yezixhobo ze-microfluidic inenzuzo yokuvelisa i-microchannels ye-3D ngaphakathi kwezixhobo ezibonakalayo ezifana neglasi ngaphandle kwesidingo sokudibanisa.Enye indlela kukwenziwa kwelaser ekhawulezileyo ngaphakathi kweglasi enkulu elandelwa yikhemikhali emanzi, kwaye enye yi-femtosecond laser ablation ngaphakathi kweglasi okanye iplastiki emanzini adityanisiweyo ukususa inkunkuma.Enye indlela kukwenza itshaneli zoomatshini kumphezulu weglasi kwaye uzitywine ngesigqubuthelo seglasi nge-femtosecond laser welding.
Umzobo 6. I-Femtosecond laser-induced etching selective etching ukulungiselela i-microfluidic channels ngaphakathi kwemathiriyeli yeglasi.
07 Ukugrunjwa okuncinci kombhobho wesitofu
I-Femtosecond laser microhole machining ithathe indawo ye-micro-EDM kwiinkampani ezininzi kwimakethi yoxinzelelo oluphezulu lwe-injector ngenxa yokuguquguquka okukhulu ekutshintsheni iiprofayili zemingxuma yokuhamba kunye namaxesha amafutshane omatshini.Ukukwazi ukulawula ngokuzenzekelayo indawo ekugxilwe kuyo kunye ne-tilt ye-beam ngentloko yokuskena kwangaphambili kuye kwakhokelela kuyilo lweeprofayili zokuvula (umzekelo, umgqomo, i-flare, i-convergence, i-divergence) enokukhuthaza i-atomization okanye ukungena kwigumbi lokutsha.Ixesha lokugaya lixhomekeke kumthamo we-ablation, kunye nobukhulu be-drill ye-0.2 - 0.5 mm kunye nobubanzi bomngxuma we-0.12 - 0.25 mm, okwenza obu buchule buphindwe kashumi ngokukhawuleza kune-micro-EDM.I-Microdrilling yenziwa ngezigaba ezithathu, kubandakanywa ukurhabaxa kunye nokugqitywa kwemingxuma yokulinga.I-Argon isetyenziswa njengegesi encedisayo ukukhusela umngxuma wokutsala amanzi kwi-oxidation kunye nokukhusela i-plasma yokugqibela ngexesha lokuqala.
Umzobo 7. I-Femtosecond i-laser echanekileyo ephezulu yokuchaneka komngxuma we-taper oguqulweyo we-injector ye-injini ye-diesel.
08 I-laser texturing ekhawulezayo
Kwiminyaka yakutshanje, ukuze kuphuculwe ukuchaneka komatshini, ukunciphisa umonakalo wezinto eziphathekayo, kunye nokwandisa ukusebenza kakuhle, intsimi ye-micromachining iye ngokuthe ngcembe ibe yingqwalasela yabaphandi.I-laser ye-Ultrafast ineenzuzo ezahlukeneyo zokucwangcisa ezifana nomonakalo ophantsi kunye nokuchaneka okuphezulu, okuye kwaba yinto ekugxilwe kuyo ekukhuthazeni ukuphuhliswa kobugcisa bokucubungula.Kwangaxeshanye, iilaser ze-ultrafast zinokusebenza kwizinto ezahlukeneyo, kunye nomonakalo wezinto zokusetyenzwa kwe-laser ukwangulwalathiso olukhulu lophando.I-Ultrafast laser isetyenziselwa ukutshabalalisa izinto.Xa ubuninzi bamandla we-laser buphezulu kunomda wokukhupha izinto, umphezulu wezinto ezichithwayo uya kubonisa isakhiwo se-micro-nano esineempawu ezithile.Uphando lubonisa ukuba lo mphezulu ukhethekileyo Ulwakhiwo yinto eqhelekileyo eyenzekayo xa izinto zokusetyenzwa kwelaser.Ukulungiswa kwezakhiwo ze-micro-nano ezingaphezulu kunokuphucula iipropati zezinto ngokwazo kwaye zikwavumela ukuphuhliswa kwezinto ezintsha.Oku kwenza ukulungiswa kwezakhiwo ze-micro-nano ze-surface nge-laser ye-ultrafast indlela yobugcisa kunye nokubaluleka kophuhliso olubalulekileyo.Okwangoku, kwizixhobo zetsimbi, uphando malunga ne-ultrafast laser surface texturing inokuphucula iimpawu zokumanzisa umphezulu wesinyithi, ukuphucula ukukhuhlana komphezulu kunye neempawu zokunxiba, ukuphucula ukunamathela kwengubo, kunye nokwanda kolwalathiso kunye nokunamathela kweeseli.
Umzobo 8. Iimpawu ze-Superhydrophobic ze-laser-prepared silicon surface
Njengobuchwephesha be-cutting-edge processing, i-ultrafast laser processing ineempawu zendawo encinci echaphazelekayo ukushisa, inkqubo engahambelaniyo yokusebenzisana nezinto eziphathekayo, kunye nokulungiswa okuphezulu ngaphaya komda we-diffraction.Iyakwazi ukuqonda umgangatho ophezulu kunye nokuchaneka okuphezulu kwe-micro-nano processing yezinto ezahlukeneyo.kunye ne-dimensional-dimensional micro-nano yokwakhiwa kwesakhiwo.Ukufezekisa ukuveliswa kwe-laser yezinto ezikhethekileyo, izakhiwo ezinzima kunye nezixhobo ezizodwa zivula iindlela ezintsha zokwenza i-micro-nano.Okwangoku, i-laser ye-femtosecond isetyenziswe ngokubanzi kwiinkalo ezininzi zesayensi: i-laser ye-femtosecond ingasetyenziselwa ukulungisa izixhobo ezahlukeneyo ze-optical, ezifana ne-microlens arrays, i-bionic compound eyes, i-optical waveguides kunye ne-metasurfaces;usebenzisa ukuchaneka kwayo okuphezulu, isisombululo esiphezulu kunye ne-3-dimensional processing capabilities, i-laser ye-femtosecond inokulungiselela okanye idibanise i-microfluidic kunye ne-optofluidic chips ezifana ne-microheater components kunye ne-three-dimensional microfluidic channels;Ukongeza, i-laser ye-femtosecond nayo inokulungiselela iintlobo ezahlukeneyo ze-micro-nanostructures yomhlaba ukufezekisa i-anti-reflection, i-anti-reflection, i-super-hydrophobic, i-anti-icing kunye neminye imisebenzi;ayisiyiyo loo nto kuphela, i-laser ye-femtosecond iye yasetyenziswa kwintsimi ye-biomedicine, ebonisa ukusebenza okugqwesileyo kwiinkalo ezifana ne-biological micro-stents, i-substrates yenkcubeko yeseli kunye ne-biological microscopic imaging.Izicelo ezibanzi ezilindelweyo.Okwangoku, imimandla yesicelo se-femtosecond laser processing iyanda unyaka nonyaka.Ukongeza kwi-micro-optics ekhankanywe ngasentla, i-microfluidics, i-micro-nanostructures enemisebenzi emininzi kunye nezicelo zobunjineli be-biomedical, ikwadlala indima enkulu kwezinye iindawo ezivelayo, ezifana nokulungiswa kwe-metasurface., ukuveliswa kwe-micro-nano kunye nokugcinwa kolwazi lwe-multi-dimensional optical, njl.
Ixesha lokuposa: Apr-17-2024
